Exclusive extracts from this 70-page-long report:
- Who are the key players?
Most companies in the industry are fabless, outsourcing the manufacture of silicon wafers. However, an increasing number of companies tend to externalise additional parts of the production chain, namely back-end production, which involves lower added-value activities such as testing and packaging. Thus, the structure of semiconductor companies is becoming leaner and more asset-light, and focused on added-value operations such as research and development, supply-chain management and sales. A third type of company, specialising in semiconductor IP (e.g. ARM), is focused exclusively on the design of semiconductors, licensing intellectual property to other chip manufacturing companies. [...]
Groups analysed in this report include: Intel, Samsung, TSMC, Qualcomm, SK Hynix, Toshiba Electronic Devices & Components, Broadcom, Micron Technology, MediaTek and Infineon.
- What are the players' strategies?
In order to consolidate its leadership in the memory business, Samsung has focused on marketing technologically advanced, high value-added products – these include the world's first 10nm-class DRAM and 64-layer V-NAND (3D-NAND), as well as high-density SSDs for data centres – primarily targeting high-growth mobile and enterprise storage markets. Samsung, which has already commenced mass-production of third-generation 3D NAND, aims to bank on the supply shortage in the flash memory […]
- What are the players' key growth and profitability drivers?
MediaTek's results were up 29.2% year-over-year thanks to increased shipments in consumer electronics chips to Asia (excluding Taiwan), a region which accounted for 92% of the group's revenue. The group's ICs primarily power made-in-China premium and mainstream mobile devices. [...]